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Verification of Cleaning Properties of New Halogen-Free Solder Paste [Joint Research]

Introduction to the morphological changes in flux residues after soldering and their impact on cleanability.

Solder paste is required to have characteristics such as halogen-free and high wettability in high-reliability areas like the automotive industry. However, even in high-reliability fields, there is a demand for residue-free performance, even for no-clean types, and there are situations where cleaning is necessary. This paste contains difficult-to-dissolve substances that make effective cleaning challenging with conventional "solvent cleaning" methods, revealing issues related to cleaning. Therefore, we conducted cleaning performance verification in collaboration with the developers of the paste. Detailed information can be viewed through the related links. *Detailed information can be viewed through the related links. *The PDF document is a technical material that explains the evolution and challenges of power devices.

  • 【共同研究】新型ハロゲンフリーはんだペースト洗浄性検証1.JPG
  • 【共同研究】新型ハロゲンフリーはんだペースト洗浄性検証2.JPG
  • 【共同研究】新型ハロゲンフリーはんだペースト洗浄性検証3.JPG
  • Cleaning agents

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