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Verification of Cleaning Properties of New Halogen-Free Solder Paste [Joint Research]

Introduction to the morphological changes in flux residues after soldering and their impact on cleanability.

Solder paste is required to have characteristics such as halogen-free and high wettability in high-reliability areas like the automotive industry. However, even in high-reliability fields, there is a demand for residue-free performance, even for no-clean types, and there are situations where cleaning is necessary. This paste contains difficult-to-dissolve substances that make effective cleaning challenging with conventional "solvent cleaning" methods, revealing issues related to cleaning. Therefore, we conducted cleaning performance verification in collaboration with the developers of the paste. Detailed information can be viewed through the related links. *Detailed information can be viewed through the related links. *The PDF document is a technical material that explains the evolution and challenges of power devices.

Company：ゼストロンジャパン
Price：Other

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Verification of paste cleaning properties

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Verification of the cleanliness of fine joining solder paste.

Introducing a comprehensive cleanliness evaluation case using FT-IR and SEM-EDS! This highlights the importance of analysis in the cleaning of fine joints.

As electronic devices become more advanced and compact, the importance of fine solder paste in high-reliability fields such as power semiconductors, automotive, and industrial equipment is increasing. However, the growing demand for reduced electrode spacing, fine pitch, and low stand-off mounting has brought to light the risks associated with flux residue after soldering, which previously did not pose a problem, affecting insulation reliability and the quality of subsequent processes. For these reasons, there is an increasing number of situations where a decision must be made regarding whether or not to perform flux cleaning from the perspective of ensuring reliability, making the cleaning of high-performance solder paste and flux a new challenge. In this study, in collaboration with Japan Superior Co., we focused on the "high-reliability solder paste for fine bonding" developed by the company, examining the cleaning characteristics in fine bonding and verifying the usefulness of evaluation through FT-IR and SEM-EDS based on chemical analysis. *For detailed content of the article, please refer to the related link. For more information, feel free to download the PDF or contact us directly.*